Jet Impingement Cooling of Electronic Modules: Effect of the Nozzle Position

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dc.contributor.authorAlbayrak, M.
dc.contributor.authorSarper, B.
dc.contributor.authorErdinc, M.T.
dc.contributor.authorAydin, O.
dc.date.accessioned2025-03-17T12:22:57Z
dc.date.available2025-03-17T12:22:57Z
dc.date.issued2023
dc.departmentTarsus Üniversitesi
dc.description14th International Conference on Thermal Engineering: Theory and Applications, ICTEA 2023 -- 25 May 2023 through 27 May 2023 -- Yalova -- 306049
dc.description.abstractIn this study, jet impingement cooling of electronic modules with a series of jet nozzles is studied numerically. Three-dimensional numerical simulations are conducted for two alternative jet Reynolds numbers (Re! =8568 and 14023) at various dimensionless nozzle positions (s! ⁄b=0.166-0.5) and validated with experimental data. The study focuses on evaluating the influence of nozzle position on the temperature distribution and local and average heat transfer characteristics on the module surfaces. As a consequence of the study, it is determined that the position of the nozzles has a substantial influence on the local and average heat transfer characteristics, and the convective heat transfer is always greater in the impingement region than in the other regions of the modules. © 2023, Toronto Metropolitan University. All rights reserved.
dc.description.sponsorshipTürkiye Bilimler Akademisi
dc.description.sponsorshipTürkiye Bilimsel ve Teknolojik Araştırma Kurumu, TÜBİTAK, (121M184)
dc.identifier.issn2562-9034
dc.identifier.issue1
dc.identifier.scopus2-s2.0-85182010470
dc.identifier.scopusqualityQ4
dc.identifier.urihttps://hdl.handle.net/20.500.13099/1500
dc.identifier.volume2023
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherToronto Metropolitan University
dc.relation.ispartofInternational Conference on Thermal Engineering
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.snmzKA_Scopus_20250316
dc.subjectConvective heat transfer
dc.subjectElectronic modules
dc.subjectJet impingement
dc.subjectNusselt number
dc.titleJet Impingement Cooling of Electronic Modules: Effect of the Nozzle Position
dc.typeConference Object

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